Microwave and electron beam devices
Thermal and mechanical design for accelerators, gyrotrons, klystrons, traveling-wave tubes, electron guns, collectors, RF circuits, and vacuum windows.
Engineering services
From first model to qualified hardware.
Dymenso develops thermal-mechanical solutions for microwave, electron beam, accelerator, and vacuum systems—from milliwatt electronics cooling to megawatt RF power.
- Design
- Devices and RF components
- Analysis
- Thermal, CFD, and structural
- Build
- Precision vacuum hardware
- Verify
- RF testing and metrology
Capabilities
Engineering depth where performance is hardest.
Work with one team across device physics, cooling, structural integrity, fabrication, and measurement. Services can support a focused analysis task or a complete hardware development program.
Microwave components
Custom RF loads, filters, barrier windows, and transmission components developed around demanding power, frequency, vacuum, and interface requirements.
Thermal engineering
Cooling-system and heat-transfer design for single-phase and multiphase systems, including electronics cooling and high-heat-flux hardware.
Computational fluid dynamics
ANSYS Fluent analysis of flow, pressure loss, heat transfer, phase behavior, and coupled multiphysics performance.
Structural engineering
Finite-element analysis covering nonlinear material behavior, plastic deformation, vibration, fatigue, thermal stress, and mechanical loading.
RF testing and characterization
Vector network analyzer measurements and microwave characterization for research hardware, prototypes, and production components.
Precision fabrication
Manufacturing of complex, high-precision copper and vacuum-electronics structures using in-house CNC machining and specialized joining processes.
Explore manufacturing3D metrology
Dimensional inspection and precision measurement services for components, assemblies, process verification, and final acceptance.
Integrated execution
One engineering thread through the program.
Analysis decisions stay connected to manufacturability, inspection, and test—reducing handoff gaps between the model and the finished component.
- DefineTranslate performance, interface, vacuum, and operating requirements into an engineering basis.
- DesignDevelop device architecture, cooling passages, structures, and production-ready geometry.
- AnalyzeResolve thermal, fluid, structural, and coupled behavior before fabrication.
- VerifyConfirm hardware through dimensional inspection and RF characterization.
Bring us the difficult part of the system.
Tell us what the hardware must withstand, absorb, transmit, or measure. We’ll help define the right engineering scope.